• N2 BWS.png

N2 BWS

BWS3200 RSC2E2

N2 BWS is mounted together with the Wafer Sorter. The area where the Wafer is stored, such as Test Wafer and Process Wafer, is stored in a POD with low humidity and low oxygen to control the reaction of the film on the surface of the Wafer within the minimum range.

It can store 800/1600/3200 wafers

Through a small amount of N2 flow purge, low oxygen, low humidity, high cleanliness environmental control.

Auto Teaching can be realized

Through the shutter structure in front of the Wafer that can be opened and closed, the size of the opening when taking and placing the film is reduced.


Model: BWS800 RI76172
Moving object: 300mm Wafer: Φ300±0.2mm thickness: 775μm±20μm
Cartridge: 300mm FOUP 25 section (SEMI E47.1) 300mm FOSB 25 section (SEMI M31)
Supply voltage: 3-phase AC208V±10% 50/60Hz±5%
Current consumption: 10kVA (30A/200VAC) including FFU
Vacuum (element pressure) : -80kPa ~ -90kPa
Vacuum (flow) : 60L/min
Air (element pressure) : 0.6MPa ~ 0.7MPa
Air (flow) : 30L/min
N2 (elemental pressure) : 0.4MPa ~ 0.5MPa
N2 (flow rate) : 300L/min

Model: BWS1600 RI76192
Moving object: 300mm Wafer: Φ300±0.2mm thickness: 775μm±20μm
Cartridge: 300mm FOUP 25 section (SEMI E47.1) 300mm FOSB 25 section (SEMI M31)
Supply voltage: 3-phase AC208V±10% 50/60Hz±5%
Current consumption: 10kVA (30A/200VAC) including FFU
Vacuum (element pressure) : -80kPa ~ -90kPa
Vacuum (flow) : 60L/min
Air (element pressure) : 0.6MPa ~ 0.7MPa
Air (flow) : 30L/min
N2 (elemental pressure) : 0.4MPa ~ 0.5MPa
N2 (flow rate) : 600L/min

Model: BWS3200 RSC2E2
Moving object: 300mm Wafer: Φ300±0.2mm thickness: 775μm±20μm
Cartridge: 300mm FOUP 25 section (SEMI E47.1) 300mm FOSB 25 section (SEMI M31)
Supply voltage: 3-phase AC208V±10% 50/60Hz±5%
Current consumption: 25kVA (75A/200VAC) including FFU
Vacuum (element pressure) : -80kPa ~ -90kPa
Vacuum (flow) : 60L/min
Air (element pressure) : 0.6MPa ~ 0.7MPa
Air (flow) : 30L/min
N2 (elemental pressure) : 0.4MPa ~ 0.5MPa
N2 (flow) : 1200L/min